Module Mount Interposer

ABSTRACT

A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

FIELD

The embodiments discussed herein relate generally to communicationmodules. More particularly, example embodiments relate to module mountinterposers for selectively engaging communication modules with a hostdevice.

BACKGROUND

Communication modules, such as an optical transceiver module, areincreasingly used in optoelectronic communication. Some communicationmodules may be mounted to a host device by soldering the communicationmodule to the host device. A communication module typically communicateswith a printed circuit board (PCB) of the host device by transmittingand/or receiving electrical signals to and/or from the host device PCB.These electrical signals can also be transmitted by or to the moduleoutside the host device as optical and/or electrical signals.

The subject matter claimed herein is not limited to embodiments thatsolve any disadvantages or that operate only in environments such asthose described above. Rather, this background is only provided toillustrate one exemplary technology area where some embodimentsdescribed herein may be practiced.

SUMMARY

These and other limitations are overcome by embodiments of the inventionwhich relate to systems and methods for engaging communication moduleswith a host device.

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the Description ofEmbodiments. This Summary is not intended to identify key features oressential characteristics of the claimed subject matter, nor is itintended to be used as an aid in determining the scope of the claimedsubject matter.

In an example embodiment, a module mount interposer may include one ormore fastener receivers configured to mechanically couple with one ormore fasteners so as to mechanically and electrically couple a module tothe interposer. The module mount interposer may also include a coreconfigured to electrically couple with the module, wherein each of thefastener receivers are mechanically coupled to the core. The modulemount interposer may additionally include a solder layer electricallycoupled to the core and configured to electrically couple with a printedcircuit board (PCB) so as to provide an electrical signal from themodule to the PCB and to provide an electrical signal from the PCB tothe module.

In another example embodiment, a module mount frame may include one ormore fastener receivers configured to mechanically couple with one ormore fasteners so as to mechanically couple a module to the frame. Themodule mount frame may also include a medial board. The medial board mayinclude a core configured to electrically couple with the module. Themedial board may also include a solder layer electrically coupled to thecore and configured to electrically couple with a PCB so as to providean electrical signal from the module to the PCB and to provide anelectrical signal from the PCB to the module.

In yet another example embodiment, a module includes a housing of amodule defining a plurality of holes. The module may also include amodule mount mechanism. The module mount mechanism may include one ormore fasteners. The module mount mechanism may also include aninterposer. The interposer may include one or more fastener receiversconfigured to mechanically couple with the one or more fasteners so asto mechanically couple the housing and electrically couple the module tothe interposer. The interposer may also include a beam grid configuredto electrically couple with the module when the module is mechanicallyand electrically coupled to the interposer. The interposer mayadditionally include a core electrically coupled to the beam grid,wherein the plurality of fastener receivers are mechanically coupled tothe core. The interposer may include a solder layer electrically coupledto the core and configured to electrically couple with a PCB so as toprovide an electrical signal from the module to the PCB and to providean electrical signal from the PCB to the module.

Additional features and advantages of the invention will be set forth inthe description which follows, and in part will be obvious from thedescription, or may be learned by the practice of the invention. Thefeatures and advantages of the invention may be realized and obtained bymeans of the instruments and combinations particularly pointed out inthe appended claims. These and other features of the present inventionwill become more fully apparent from the following description andappended claims, or may be learned by the practice of the invention asset forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

To further clarify the above and other advantages and features of thepresent invention, a more particular description of the invention willbe rendered by reference to specific embodiments thereof which areillustrated in the appended drawings. It is appreciated that thesedrawings depict only typical embodiments of the invention and are,therefore, not to be considered limiting of its scope. The inventionwill be described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1A is a top perspective view of a board mount assembly;

FIG. 1B is an exploded top perspective view of the board mount assembly;

FIG. 1C is an exploded bottom perspective view of the board mountassembly;

FIG. 2A is an exploded top perspective view of an interposer of FIGS.1A-1C;

FIG. 2B is a bottom exploded perspective view of the interposer;

FIG. 3 is a top perspective view of an interposer including alignmentpins;

FIG. 4A is an exploded top perspective view of a module mount framesystem; and

FIG. 4B is a bottom perspective view of the module mount frame system.

DESCRIPTION OF EMBODIMENTS

Some communication modules may be configured to mount to a host device,such as a printed circuit board (PCB), through a mounting interposer.Mounting interposers may be used to physically connect the communicationmodule to the PCB so as to electrically couple the communication moduleto the PCB. Mounting interposers may be used to make mounting andunmounting the communication module from the PCB quicker and simpler

Example embodiments may relate to module mount interposers for engagingboard mount modules with a PCB. Example embodiments may also relate tomodule mount frames that include medial boards for engaging the boardmount module with the PCB. Embodiments described herein may includefewer and/or less complex parts, and may permit simplified assemblycompared to traditional module mount mechanisms. In addition,embodiments of the module mount interposer and/or module mount framedescribed herein may eliminate the need for complex clamping mechanismsand pre-mounted nuts on the PCB, which may reduce the amount of timerequired for replacing a board mount module compared to the module mountmechanisms that include complex clamping mechanisms and pre-mounted nutson the PCB. For at least these reasons, embodiments of the module mountinterposer and/or module mount frame may be more efficient to implementthan traditional module mount mechanisms.

Furthermore, compared to traditional module mount mechanisms,embodiments of the module mount interposer and/or module mount framedescribed herein may reliably couple, both mechanically andelectrically, the board mount module to the PCB so as to provide and/orreceive electrical signals to or from the board mount module and to orfrom the PCB. Some embodiments of the module mount interposer and/ormodule mount frame may further include one or more alignment pinsconfigured to align the board mount module with the module mountinterposer and/or module mount frame so as to improve mechanical andelectrical coupling to the module mount interposer and/or module mountframe.

Reference will now be made to the drawings wherein like structures willbe provided with like reference designations. It should be understoodthat the drawings are diagrammatic and schematic representations ofexample embodiments and, accordingly, are not limiting of the scope ofthe present invention, nor are the drawings necessarily drawn to scale.It should also be understood that many of the features of the disclosedembodiments may be substantially symmetrical and a pluralized referenceto a feature may refer to a pair of similar features of which only onemay be labeled in the drawings.

FIGS. 1A, 1B, and 1C are, respectively, top perspective, exploded topperspective, and exploded bottom perspective views of a board mountassembly (BMA) 100 including a module mount interposer (hereininterposer) 104 for engaging a board mount module (herein module) 102with a PCB 106. With combined reference to FIGS. 1A-1C, the BMA 100 maybe employed in transmitting and/or receiving communication signals andin the conversion of optical signals to and from electrical signals.

The BMA 100 may also include at least one of bolt 108 a, bolt 108 b,bolt 108 c, and/or bolt 108 d (collectively ‘bolts 108’). Additionally,the BMA may include at least one of nut 110 a, nut 110 b, nut 110 c,and/or nut 110 d (collectively ‘nuts 110’). The bolts 108 and the nuts110 may be employed for mechanically coupling the module 102 with theinterposer 104. The nuts 110 may be mounted on a core, which isdiscussed in more detail below, of the interposer 104. The module 102may include a housing 140 which defines at least one of bolt hole 132 a,bolt hole 132 b, bolt hole 132 c, and/or bolt hole 132 d (collectively‘bolt holes 132’). Each of the bolt holes 132 defined by the housing 140may be positioned so as to be aligned with a corresponding one of thenuts 110 on the interposer 104. Each of the bolt holes 132 defined bythe housing 140 may be configured to permit a corresponding one of thebolts 108 to pass through and couple with a corresponding one of thenuts 110 on the interposer 104.

One or more of the bolts 108 may include a head portion 136 a-d and abody portion 134 a-d (shown, e.g., in FIGS. 1B and 1C). A length of thebolts 108 may be determined based on the housing 140 of the module 102so as to couple, both mechanically and electrically, the module 102 withthe interposer 104. An external diameter of the body portion 134 a-d ofthe bolts 108 may be sized to fit within an internal diameter of thebolt holes 132. Likewise, the body portion 134 a-d of each of the bolts108 may include a threaded portion configured to engage with threads ofan internal cavity 138 a-d of the corresponding one of the nuts 110. Thehead portion 136 a-d of each of the bolts 108 may be oversized incomparison to the internal diameter of the bolt holes 132 defined by thehousing 140. When the bolts 108 are engaged with the nuts 110 (shown,e.g., in FIG. 1A), the head portion 136 a-d of each of the bolts 108 mayurge the module 102 towards the interposer 104.

The module 102 may include multiple module electrical connections 142 ona bottom portion of the module 102 (shown, e.g., in FIG. 1C). Likewise,the interposer 104 may include a beam grid 214 (shown, e.g., in FIG.1B), which is discussed in more detail below, with multiple beam gridelectrical connections 164. The module electrical connections 142 andthe beam grid electrical connections 164 may be arranged in the same orsimilar configuration. When the bolts 108 are engaged with the nuts 110,each of the module electrical connections 142 may be electricallycoupled to a corresponding beam grid electrical connection 164.

Furthermore, the module 102 may include at least one of alignment pin144 a, alignment pin 144 b, and/or alignment pin 144 c (collectively‘alignment pins 144’). The module 102 may include the alignment pins 144on a bottom surface 166 of the module 102. The alignment pins 144 may beemployed to align the module 102 with the interposer 104. Differentportions of the bottom surface 166 of the module 102 may includedifferent numbers of alignment pins 144. For example, a back portion ofthe bottom surface 166 of the module 102 may include two alignment pins144 (alignment pin 144 a and alignment pin 144 b) and a front portion ofthe bottom surface 166 of the module 102 may include one of thealignment pins 144 (alignment pin 144 c). The interposer 104 may defineat least one of alignment hole 146 a, alignment hole 146 b, and/oralignment hole 146 c (collectively ‘alignment holes 146’). Thealignments holes 146 may be defined such that they are similarly sized,shaped, and positioned as the alignment pins 144 on the module 102. Thealignment pins 144 may be used to discourage improper coupling of themodule 102 with the interposer 104.

Additionally, when the bolts 108 are engaged with the nuts 110, aportion 162 a-d of the housing 140 of the module 102 may be positionedbetween the head portion 136 a-d of the bolts 108 and a top surface 150a-d of the nuts 110. When the bolts 108 are engaged with the nuts 110,the housing 140 of the module 102 may be in direct contact with at leastone of a bottom surface 148 a-d of the head portion 136 a-d of the bolts108 (shown, e.g., in FIG. 1C), the top surface 150 a-d of the nuts 110(shown, e.g., in FIG. 1B), and/or a portion of a top surface 152 of theinterposer 104 (shown, e.g., in FIG. 1B). The contact between the module102 and at least one of the bottom surface 148 a-d of the head portion136 a-d of the bolts 108, the top surface 150 a-d of the nuts 110,and/or the portion of the top surface 152 of the interposer 104 mayprovide structural stability to the module 102 while coupled with theinterposer 104. The provided structural stability of the module 102 mayensure that each of the module electrical connections 142 areelectrically coupled securely to the corresponding beam grid electricalconnection 164.

The PCB 106 may include multiple PCB electrical connections 154 on a topsurface 156 of the PCB 106 (shown, e.g., in FIG. 1B). Likewise, theinterposer 104 may include a solder layer 222 (shown, e.g., in FIG. 1C),which is discussed in more detail below, on a bottom surface 160 of theinterposer 104 (shown, e.g., in FIG. 1C). The solder layer 222 mayinclude multiple solder layer electrical connections 158. The PCBelectrical connections 154 and the solder layer electrical connections158 may be arranged in the same or similar configuration. The solderlayer 222 may be employed for mechanically and electrically coupling theinterposer 104 with the PCB 106. The solder layer 222 of the interposer104 may couple with the PCB 106 through surface mount technologies(SMT). For example, the interposer 104 may couple with the PCB 106through soldering, through hole, or any other suitable surface mounttechnique. When the interposer 104 is coupled with the PCB 106, each ofthe PCB electrical connections 154 may be electrically coupled with acorresponding solder layer electrical connection 158.

Furthermore, electrically coupling the module 102 with the interposer104 and electrically coupling the interposer 104 with the PCB 106 maypermit an electrical signal generated by the module 102 to be receivedby the PCB 106 through the interposer 104. Likewise, electricallycoupling the module 102 with the interposer 104 and electricallycoupling the interposer 104 with the PCB 106 may permit an electricalsignal provided by the PCB 106 to be received by the module 102 throughthe interposer 104.

The module 102 may electrically and/or optically couple with othercomponents. For example, the module 102 may receive an optical signalvia a fiber optic cable and may convert the optical signal to anelectrical signal. In these embodiments, the module 102 may provide theelectrical signal to the interposer 104 through the multiple moduleelectrical connections 142. Additionally or alternatively, the module102 may receive an electrical signal and may manipulate the electricalsignal. The module 102 may provide the manipulated electrical signal tothe interposer 104 through the multiple module electrical connections142. Alternately or additionally, the module 102 may convert theelectrical signal to an optical signal and may transmit the opticalsignal via a fiber optic cable. Likewise, the module 102 may receive anelectrical signal from the PCB 106 via the interposer 104.

The various module electrical connections 142 may provide the sameportion or different portions of the electrical signal generated by themodule 102. For example, a first portion of the module electricalconnections 142 may provide a data portion of the electrical signalgenerated by the module 102, while a second portion of the moduleelectrical connections 142 may provide a control portion of theelectrical signal generated by the module 102. As another example, afirst portion of the module electrical connections 142 may provide adata portion of the electrical signal generated by the module 102, whilea second portion of the module electrical connections 142 may provide acontrol portion of the electrical signal generated by the module 102,and a third portion of the module electrical connections 142 may providegrounding of the module 102 to the interposer 104.

Additionally, the various module electrical connections 142 may receivethe same portion or different portions of an electrical signal providedby the PCB 106 through the interposer 104. For example, a first portionof the module electrical connections 142 may receive a data portion ofthe electrical signal provided by the PCB 106, while a second portion ofthe module electrical connections 142 may receive a control portion ofthe electrical signal provided by the PCB 106. As another example, afirst portion of the module electrical connections 142 may receive adata portion of the electrical signal provided by the PCB 106, while asecond portion of the module electrical connections 142 may receive acontrol portion of the electrical signal provided by the PCB 106, and athird portion of the module electrical connections 142 may providegrounding of the module 102 to the PCB 106 through the interposer 104.

The interposer 104 may include multiple layers and electricalcomponents, which are discussed in more detail below, configured toreceive the electrical signal from the module 102 and/or the PCB 106 andprovide the electrical signal to the PCB 106 and/or the module 102. Theinterposer 104 may be sized and shaped so as to, both mechanically andelectrically, couple with the module 102 and/or the PCB 106. Forexample, the interposer 104 may be shaped as a square, rectangle,circle, or any other suitable shape for coupling with the module 102and/or the PCB 106.

The PCB 106 may also include multiple layers configured to receive theelectrical signal from the interposer 104, provide the electrical signalto the interposer 104, manipulate the electrical signal, and/or providethe electrical signal to other components located on or external to thePCB 106. The PCB 106 may include a ground plane so as to providegrounding of the PCB 106 and/or of the various components electricallycoupled to the PCB 106.

The nuts 110 may be positioned on the interposer 104 so as to evenlydistribute pressure applied to the module 102 by the bolts 108 andapplied by the module 102 to the interposer 104. For example, the nuts110 may be positioned to receive the bolts 108 near and/or along anexternal edge of the module 102. For example, the interposer 104 may beshaped as a square and the nuts 110 may each be positioned at adifferent corner of the interposer 104. The nuts 110 may include SMTnuts.

Mechanically coupling the module 102 to the interposer 104 through theuse of the nuts 110 mounted to the interposer 104 and the bolts 108 thatpass through the bolt holes 132 defined by the housing 140 of the module102 may reduce an amount of time needed to remove and install the module102 within the BMA 100. Similarly, reducing the amount of time needed toremove and install the module 102 may ease in debugging, updating,and/or performing general maintenance of the BMA 100. Also, electricallycoupling the module 102 to the interposer 104 instead of the PCB 106,may reduce wear of the electrical connections on the PCB 106, which mayextend a lifetime of the PCB 106.

FIGS. 2A and 2B are, respectively, exploded top perspective and explodedbottom perspective views of the interposer 104 of FIGS. 1A-1C. Theinterposer 104 may be the same or similar to the interposer 104discussed above in relation to FIGS. 1A-1C.

The interposer 104 may include a coverlay 212; a beam grid 214; abondply 216; a core 218; one or more of the nuts 110; a solder mask 220;and a solder layer 222. The various components of the interposer 104 maybe configured to receive the electrical signal generated by the module102 of FIGS. 1A-1C, receive the electrical signal provided by PCB 106 ofFIGS. 1A-1C, isolate the electrical signals to reduce and/or eliminateinterference/cross-talk, and/or provide the electrical signals to thePCB 106 or the module 102 of FIGS. 1A-1C.

The coverlay 212 may be located on the top portion of the interposer 104and may define an array of coverlay holes 268. Each of the coverlayholes 268 may be configured to permit a corresponding beam gridelectrical connection 164 to pass through the coverlay 212. The coverlay212 may isolate the beam grid electrical connections 164 from each otherso as to reduce interference and/or cross-talk experienced by thevarious beam grid electrical connections 164. Likewise, the coverlay 212may be employed to seal and/or cover the bondply 216 from externalelements to reduce performance degradation of the interposer 104. Forexample, the coverlay 212 may reduce oxidation of components of theinterposer 104. Additionally, the coverlay 212 may be employed as asolder resist so as to reduce electrical coupling of various componentsof the interposer 104.

Additionally, the bondply 216 may be located between the coverlay 212and the core 218. The bondply 216 may be a thin film adhesive employedto adhere the coverlay 212 to the core 218. The bondply 216 may definean array of bondply holes 270 configured to permit a corresponding beamgrid electrical connection 164 to pass through the bondply 216.Additionally, the bondply 216 may isolate the beam grid electricalconnections 164 from each other so as to reduce interference and/orcross talk experienced by the various beam grid electrical connections164.

The core 218 may be employed to provide structure and/or stability ofthe various components of the interposer 104. For example, the core 218may provide structure for the coverlay 212, the bondply 216, and/or thesolder mask 220. Additionally, the core 218 may isolate componentslocated on the top portion of the interposer 104 from components locatedon a bottom portion of the interposer 104. Likewise, the core 218 mayinclude thermally conductive material configured to receive heatgenerated by the electrical signal within the interposer 104 and spreadthe heat throughout the core 218 so as to reduce thermal failures of theinterposer 104. The thermally conductive material of the core 218 mayinclude copper, aluminum, or any other appropriate thermally conductivematerial.

Furthermore, the core 218 may define an array of core holes 272configured to permit a corresponding beam grid electrical connection 164to pass through the core 218. Each of the core holes 272 may include aninsulator layer that electrically isolates the corresponding beam gridelectrical connection 164 from the core 218. Each insulator layer maydiscourage the corresponding beam grid electrical connection 164 frombeing electrically coupled with the core 218. Additionally oralternatively, each insulator layer may include a thermally conductivematerial configured to thermally couple the corresponding beam gridelectrical connection 164 to the core 218 so as to transfer heat fromthe corresponding beam grid electrical connection 164 to the core 218.

Likewise, the core 218 may define at least one of nut receiver hole 274a, nut receiver hole 274 b, nut receiver hole 274 c, and/or nut receiverhole 274 d (collectively ‘nut receiver holes 274’). The nut receiverholes 274 may be configured to connect a corresponding one of the nuts110 to the core 218. The nut receiver holes 274 may be sized so as topermit a bottom portion 276 a-d (shown, e.g., in FIG. 2B) of thecorresponding one of the nuts 110 to couple with the core 218. Forexample, an internal diameter of the nut receiver holes 274 may be thesame or similar size as an external diameter of the bottom portion 276a-d of the corresponding one of the nuts 110 so as to securely couplethe corresponding one of the nuts 110 with the core 218.

Likewise, each of the nut receiver holes 274 may include a solder padfor mounting the nuts 110 to the core 218. The solder pads may be shapedand/or sized to correspond to an external surface of the bottom portion276 a-d of the nuts 110. Additionally, the solder pads may be circularin shape and may extend beyond the nut receiver holes 274. For example,the size and/or shape of the solder pads may correspond to a bottomsurface of a top portion 278 a-d of the nuts 110. The solder pads mayalso ground the nuts 110 to the core 218 so as to discourage adifference in electric charge building up between the nuts 110 and thecore 218.

Additionally, the nuts 110 may mount to the core 218 through surfacemount technology. For example, the nuts 110 may be mounted to the core218 through soldering. To increase a surface area of the nuts 110 thatmechanically couple with the core 218, the top portion 278 a-d of thenuts 110 may be oversized compared to the nut receiver holes 274 definedby the core 218. Increased mechanical coupling of the nuts 110 with thecore 218 may increase a structural stability of the mechanical couplingof the module 102 with the interposer 104. Likewise, an internal cavity138 a-d of the nuts 110 may include threads that are configured tocouple with the threaded portion of the bolts 108.

The solder mask 220 may be located on the bottom portion of theinterposer 104 and may define an array of solder mask holes 280. Each ofthe solder mask holes 280 may be configured to permit a correspondingbeam grid electrical connection 164 to pass through the solder mask 220.The solder mask 220 may isolate the beam grid electrical connections 164from each other so as to reduce interference and/or cross-talkexperienced by the various beam grid electrical connections 164.Likewise, the solder mask 220 may be employed to seal and/or cover thecore 218 from external elements to reduce performance degradation of theinterposer 104. Likewise, the solder mask 220 may be employed as asolder resist so as to discourage electrical coupling of variouscomponents of the interposer 104.

The beam grid electrical connections 164 may be arranged in a grid arrayand may be configured to electrically couple with the module 102 and thesolder layer 222. The various beam grid electrical connections 164 mayreceive the electrical signal from the module 102 and may provide theelectrical signal to the solder layer 222. Likewise, the various beamgrid electrical connections 164 may receive the electrical signal fromthe solder layer 222 and may provide the electrical signal to the module102. Each of the beam grid electrical connections 164 may be sized andshaped so as to discourage the beam grid electrical connections 164 frombeing pushed all the way through the interposer 104.

FIG. 3 is a perspective view of an interposer 304 that includes at leastone of a first alignment pin 324 a and/or a second alignment pin 324 b(collectively “alignment pins 324′). The interposer 304 may bestructurally similar to the interposer 104 of FIGS. 1A-2B. The alignmentpins 324 may be located near and/or along an outside edge of theinterposer 304. The alignment pins 324 may be employed to align themodule 102 with the interposer 304. The first alignment pin 324 a may besized differently than the second alignment pin 324 b. For example, anexternal diameter of the first alignment pin 324 a may be smaller thanan external diameter of the second alignment pin 324 b. The interposer304 may be used in the BMA 100 of FIGS. 1A-1C in place of the interposer104 without alignment pins.

The housing 140 of the module 102 may define corresponding alignmentholes that are similarly sized and/or shaped as the alignment pins 324.For example, a first alignment hole defined by the housing 140 of themodule 102 may include an internal diameter that is the same or similardiameter to the external diameter of the first alignment pin 324 a.Likewise, an internal diameter of a second alignment hole defined by thehousing 140 of the module 102 may be the same or similar diameter of theexternal diameter of the second alignment pin 224 b. Additionally, theinternal diameter of the first alignment hole may be sized differentlythan the internal diameter of the second alignment hole. The alignmentpins 324 may be used to discourage improper coupling of the module 102with the interposer 304.

FIGS. 4A and 4B are, respectively, exploded top perspective and explodedbottom perspective views of a module mount frame system 404. The modulemount frame system 404 may include a mount frame (herein frame) 428 anda medial board 430. The module mount frame system 404 may be used in theBMA 100 of FIGS. 1A-1C in place of the interposer 104 without the frame428. The module mount frame system 404 may be employed to mechanicallyand/or electrically couple with the module 102 and the PCB 106 of FIGS.1A-1C. For example, the frame 428 may mechanically couple the module 102to the module mount frame system 404. Likewise, the frame 428 maymechanically couple with the PCB 106. Additionally, the medial board 430may be employed to electrically couple the module 102 to the PCB 106.The medial board 430 may receive the electrical signal generated by themodule 102, isolate the electrical signal to reduce and/or eliminateinterference/cross-talk, and/or provide the electrical signal to the PCB106. Likewise, the medial board 430 may receive the electrical signalprovided by the PCB 106, isolate the electrical signal to reduce and/oreliminate interference/cross-talk, and/or provide the electrical signalto the module 102.

The frame 428 may include PCB materials similar to the PCB 106. In theembodiment in which the frame 428 includes PCB materials, the frame 428may define one or more nut receiver holes and the nuts 110 may mount tothe frame 428 through surface mount technology similar to the nuts 110in FIGS. 1A-2C. Additionally or alternatively, the frame 428 may includeplastic and may be formed as a single piece of material. In theembodiment in which the frame 428 includes plastic, the nuts 110 may beformed into the frame 428 so as to mechanically couple the nuts 110 withthe frame 428. In some embodiments, the frame 428 may include metal andmay be formed as a single piece of material. In the embodiment in whichthe frame 428 includes metal, the nuts 110 may be formed into the frame428 so as to mechanically couple the nuts 110 with the frame 428.

Similarly, the frame 428 may include at least one of a first alignmentpin 224 a and/or a second alignment pin 224 b (collectively ‘alignmentpins 224’). The alignment pins 224 may be employed to align the module102 with the frame 428 and/or the medial board 430. The first alignmentpin 224 a may be sized differently than the second alignment pin 224 b.For example, an external diameter of the first alignment pin 224 a maybe smaller than an external diameter of the second alignment pin 224 b.

The housing 140 of the module 102 may define corresponding alignmentholes that are similarly sized and shaped as the alignment pins 224. Forexample, a first alignment hole defined by the housing 140 of the module102 may include an internal diameter that is the same or similardiameter to the external diameter of the first alignment pin 224 a.Likewise, an internal diameter of a second alignment hole defined by thehousing 140 of the module 102 may be the same or similar diameter of theexternal diameter of the second alignment pin 224 b. Additionally, theinternal diameter of the first alignment hole may be sized differentlythan the internal diameter of the second alignment hole. The alignmentpins 224 may be used to discourage improper coupling of the module 102with the frame 428. Additionally, the frame 428 may include solder balls482 on a bottom surface of the frame 428 (shown, e.g., in FIG. 4B). Thesolder balls 482 may be employed to mechanically couple the frame 428with the PCB 106. The solder balls 482 may be located on a bottomsurface 496 of the frame 428. In some embodiments, the solder balls 482may be located at corners of the frame 428. Additionally oralternatively, the solder balls 482 may be located near and/or along anoutside edge between the corners of the frame 428. In some embodiments,the solder balls 482 may substantially cover the bottom surface 496 ofthe frame 428.

Furthermore, the frame 428 may define an internal opening 484 configuredto permit the medial board 430 to fit within the internal opening 484 ofthe frame 428. When mounted on the PCB 106, the frame 428 maysubstantially surround the medial board 430 around an edge of the medialboard 430 without substantially covering a top surface 488 or a bottomsurface 490 of the medial board 430. The medial board 430 may be sizedand/or shaped so as to securely fit within the internal opening 484 ofthe frame 428. Additionally or alternatively, the frame 428 and themedial board 430 may be in contact at the edge 486 of the medial board430. For example, the edge 486 of the medial board 430 may be in contactwith an inside edge 492 of the internal opening 484 of the frame 428.The medial board 430 may be shaped and/or sized so that the frame 428aligns the module electrical connections 142 and the electricalconnections on the medial board 430. Having the frame 428 and the medialboard 430 be separate components may increase a tolerance level ofplanarity variation within the BMA 100.

The medial board 430 may include various layers similar to theinterposer 104, 204, and 304 discussed above in relation to FIGS. 2A-3.For example, the medial board 430 may include a coverlay 412, a beamgrid 414, a bondply 416, a core 418, a solder mask 420, and a solderlayer 422. The coverlay 412 may be the same or similar to the coverlay212 discussed above in relation to FIGS. 2A-2B. Likewise, the beam grid414 may be the same or similar to the beam grid 214 discussed above inrelation to FIGS. 2A-2B. Additionally, the bondply 416 may be the sameor similar to the bondply 216 discussed above in relation to FIGS.2A-2B. The core 418 may be the same or similar to the core 218 discussedabove in relation to FIGS. 2A-2B. Likewise, the solder mask 420 may bethe same or similar to the solder mask 220 discussed above in relationto FIGS. 2A-2B. Additionally, the solder layer 422 may be the same orsimilar to the solder layer 222 discussed above in relation to FIGS.2A-2B.

Various layers of the medial board 430 may define alignment board hole494 a, alignment board hole 494 b, alignment board hole 494 c, alignmentboard hole 494 d, alignment board hole 494 e, alignment board hole 494f, alignment board hole 494 g, alignment board hole 494h, alignmentboard hole 494 i, alignment board hole 494 j, alignment board hole 494k, alignment board hole 494 l, alignment board hole 494 m, alignmentboard hole 494 n, alignment board hole 494 o, and/or alignment boardhole 494 p (collectively ‘alignment board holes 494’).

The alignment board holes 494 may be defined such that they aresimilarly sized, shaped, and positioned as corresponding alignment pinson the module 102. The alignment board holes 494 may be the same orsimilar to the alignment holes 146 discussed above in relation to FIGS.1A-1C. Likewise, the corresponding alignment pins on the module 102 maybe the same or similar to the alignment pins 144 discussed above inrelation to FIGS. 1A-1C. The corresponding alignment pins on the module102 and the alignment board holes 494 may be used to discourage impropercoupling of the module with the medial board 430. Additionally, thealignment pins on the module 102 and the alignment board holes 494 maybe used to align the module 102 with the medial board 430 in place ofthe frame 428 aligning the module 102 with the medial board 430.Likewise, the frame 428 may align the module 102 with the PCB 106.

In some embodiments, the alignment board holes 494 may be omitted. Inthese embodiments, the frame 428 and/or the alignment pins 224 may beused to align the module 102 with the medial board 430 and the PCB 106.In these embodiments, the frame 428 and the alignment pins 224 aligningthe module 102 with the medial board 430 may increase a tolerance levelof planarity variation within the BMA 100.

Additionally, in some embodiments, the solder layer 422 may be omitted.In these embodiments, the beam grid electrical connections 164 may makedirect contact with the PCB 106. Additionally, the medial board 430,when the solder layer 422 is omitted, may be electrically coupled to thePCB 106 but not mechanically coupled top the PCB 106. Additionally oralternatively, an additional beam grid may be electrically coupled tothe PCB 106 and the beam grid electrical connections 164. The additionalbeam grid may be employed for electrically coupling the PCB 106 and thebeam grid electrical connections 164 through additional beam gridelectrical connections.

The present invention may be embodied in other specific forms withoutdeparting from its essential characteristics. The described embodimentsare to be considered in all respects only as illustrative and notrestrictive. The scope of the invention is, therefore, indicated by theappended claims rather than by the foregoing description. All changeswhich come within the meaning and range of equivalency of the claims areto be embraced within their scope.

1. A module mount interposer comprising: one or more fastener receiversconfigured to mechanically couple with one or more fasteners so as tomechanically and electrically couple a module to an interposer; a coreconfigured to electrically couple with the module, wherein each of thefastener receivers is mechanically coupled to a first face of the core;and a solder layer including: a plurality of electrical connectionselectrically coupled to the core and configured to electrically couplewith a printed circuit board (PCB) so as to provide an electrical signalfrom the module to the PCB and to provide an electrical signal from thePCB to the module; and a plurality of solder ball connectorsmechanically coupled to a second face of the core, the plurality ofsolder ball connectors located directly opposite the fastener receivers.2. The module mount interposer of claim 1, further comprising one ormore alignment pins configured to align the module when the module ismechanically and electrically coupled to the interposer.
 3. A modulemount mechanism including the module mount interposer of claim 1 and oneor more fasteners.
 4. The module mount mechanism of claim 3, whereineach of the fasteners include a head and each of the fasteners passthrough a corresponding hole defined by the module, wherein the head ofthe fasteners are oversized compared to the corresponding holes definedby the module and the heads urge the module towards the interposer. 5.The module mount mechanism of claim 3, wherein each of the fastenerscomprises a bolt and the each of the fastener receivers comprises a nut.6. The module mount mechanism of claim 5, wherein each of the nutscomprises a surface mount technology (SMT) nut.
 7. The module mountmechanism of claim 3, wherein each of the fasteners and nuts areelectrically coupled to a ground plane in the core which is electricallycoupled to a ground plane in the PCB.
 8. The module mount interposer ofclaim 1, wherein the core is configured as a square and the fastenerreceivers comprise four fastener receivers located at different cornersof the core.
 9. The module mount interposer of claim 1 wherein the coreis configured to electrically couple with the module through a beam gridwhen the module is mechanically and electrically coupled to theinterposer.
 10. A module mount frame system comprising: a frameincluding one or more fastener receivers mechanically coupled to a firstface of the frame, the one or more fastener receivers configured tomechanically couple with one or more fasteners so as to mechanicallycouple a module to a frame; a medial board comprising a core configuredto electrically couple with the module; and a solder layer including: aplurality of electrical connections electrically coupled to the core andconfigured to electrically couple with a PCB so as to provide anelectrical signal from the module to the PCB and to provide anelectrical signal from the PCB to the module; and a plurality of solderball connectors mechanically coupled to a second face of the frame, theplurality of solder ball connectors located directly opposite thefastener receivers.
 11. The module mount frame system of claim 10,further comprising one or more alignment pins configured to align themodule when the module is mechanically coupled to the frame.
 12. Amodule mount mechanism including the module mount frame system of claim10 and one or more fasteners.
 13. The module mount mechanism of claim12, wherein each of the fasteners include a head and each of thefasteners pass through a corresponding hole defined by the module,wherein the heads of the fasteners are oversized compared to thecorresponding holes defined by the module and the heads urge the moduletowards the frame and the medial board.
 14. The module mount framesystem of claim 10, wherein the frame comprises a PCB frame.
 15. Themodule mount frame system of claim 10, wherein the frame comprises aplastic fame.
 16. The module mount frame system of claim 10, wherein thecore is configured to electrically couple with the module through a beamgrid when the module is mechanically coupled to the frame, wherein theframe substantially surrounds the medial board around an outside edge ofthe medial board without substantially covering a top surface or abottom surface of the medial board.
 17. A module comprising: a housingof a module defining a plurality of holes; and a module mount mechanismcomprising: one or more fasteners; and an interposer comprising: one ormore fastener receivers configured to mechanically couple with thefasteners so as to mechanically couple the housing and electricallycouple the module to the interposer; a beam grid configured toelectrically couple with the module when the module is mechanically andelectrically coupled to the interposer; a core electrically coupled tothe beam grid, wherein the fastener receivers are mechanically coupledto a first face of the core; and a solder layer including: a pluralityof electrical connections electrically coupled to the core andconfigured to electrically couple with a PCB so as to provide anelectrical signal from the module to the PCB and to provide anelectrical signal from the PCB to the module; and a plurality of solderball connectors mechanically coupled to a second face of the core, theplurality of solder ball connectors located directly opposite thefastener receivers.
 18. The module of claim 17, wherein the interposerfurther comprises one or more alignment pins configured to align thehousing of the module when the module is mechanically and electricallycoupled to the interposer.
 19. The module of claim 17, wherein each ofthe fasteners include a head and each of the fasteners pass through acorresponding hole defined by the housing of the module, wherein theheads of the fasteners are oversized compared to the corresponding holesdefined by the housing of the module and the heads urge the housing ofthe module towards the interposer.
 20. The module of claim 17, whereineach of the fasteners comprises a bolt and each of the fastenerreceivers comprises a nut.